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Analysis of high power density, high-frequency power transformer
In order to reduce the power electronics equipment size and weight, has increased its frequency to the MHz range. As we all know, affect the overall size and weight of power converters, the main problem is the size of magnetic components in which the weight. In the development of this high frequency range of magnetic components, the need to focus on its skin effect and eddy current loss to the winding and core design, and corresponding to the core material and conductor material specifications selection brought about by the restrictions. In this paper, the operating frequency of 2MHz, power density greater than 400W/cm3, power range of 50 ~ 100W, the output voltage of 1.5V, the efficiency is higher than 99% of the electronic transformer design discussion. In order to achieve these targets, we must first increase the density of copper windings, so that it more than conventional stranded wire density, and resolve to music around the technology to produce multi-layer copper foil winding process issues. This eliminates the need for winding the outer winding layer connection, this constitutes a close overlap of the Z-shaped winding structure, in order to achieve a high density of copper winding, low copper loss and low leakage inductance.
The miniaturization of power electronic equipment problems
Electronic components of small, thin, light weight is with the desktop personal computers, laptops and mobile electronic devices such as miniaturization and multi-functional development needs to be progressive. As electronic devices, magnetic components of its volume weight ratio of 25% or more, so a long time, it can be transportation for low-voltage and high current, low-loss and take a small mounting area, and good heat dissipation properties of small electronic transformer on the special attention. In these requirements, the emergence of the 1980s that a distributed power system, resulting in small power components can be used to supply a single circuit board mounting. For example, for desktop personal computers, switching power supply with a 200W power, the output voltage of 5V and 12V, 80% efficiency, power density packaging 1W/in3. Since then, with the introduction of new high-efficiency power supply topology and resonant, quasi-resonant switching method to reduce switching losses, and the operating frequency to MHz range, not only the circuit greatly reduced the size of magnetic components, and developed a 100W and more output power, output voltage as low as 1.5V, the efficiency of 99% of compact electronic transformers. This compact design of the transformer, the first problem encountered is the high power density and efficiency trade-offs between the two intercropping, which developed the main technique is to use overlapping flat copper winding structure to increase the density of copper The method reduces the high frequency (MHz level) within the skin effect and eddy current losses. Reported in the literature, it has been calculated, using the copper foil thickness of less than 4.3mil (mil) (this thickness dimension of 2MHz frequency, the skin depth of copper twice) flat ring made of a single turn, to get 75μΩ of secondary single-turn resistance, the inner one turn for 51mil, if taken to its outer layers in parallel, the outer 9.79-inch single-turn radius of the need, if it is four in parallel, compared to 7 inches. Therefore, in order to guarantee access to the installation area is small enough, many single-turn must be connected in parallel layers, forming a structure similar to the geometric cube.
Magnetic electronic components (mainly electronic transformers and inductors) and a small thin process, in the ordinary three-dimensional, based on the transformer inductors, has experienced three stages of development and has the following types: the first stage of development is ” planar “(thin) electronic transformer. Series has been mass production. The second stage is the “chip” of transformers, inductors. They are with the development of SMT technology gradually improved, and now also has formed a series with volume. The third stage is the “thin film” Transformers and inductors have a small batch production. These four stages developed various types of transformer inductors have their applications, and not with the stage of development and by “generation” of the situation is completely replaced. Small, thin, and light conventional three-dimensional inductors and transformers transformer inductors compared with the very obvious advantages.
The miniaturization of magnetic components of the manufacturing process, can be said to have been relatively mature, but the flat wound coil type, “PCB”-type and mixed type magnetic components, does not apply to a very low resistance of magnetic components. Moreover, PCB manufacturing method of magnetic components to achieve an external pin interconnect layer, which significantly increases interconnect resistance, thus limiting the use of more layers of coils.
The manufacture of hybrid components are vulnerable to relatively large thick plastic printed conductor resistivity and thickness restrictions. Many overlapping layers of copper foil winding off the plane around, you can get a very low resistance, it is mainly limited by the small current winding single-barrel design and structure.
In discussing the design and manufacture of transformers, the study was to investigate a variety of curved torsion winding method, which includes PCB copper production of Printed Circuit interconnects between layers, resulting in a Z-shaped folded layers of primary winding; in a similar way to Z-shaped fold, and leads to the center tap on the deposited copper foil, copper foil on each floor to turn on the soldering on the copper output and output layers in parallel, can be made of the secondary winding. Z-stack in the production process, the initial level should also be stacked using the appropriate overlap between the order, to ensure that primary and secondary layer of the close overlap between layers.
